Shanoc Electronics

Shanoc Electronics has many years of experience servicing major industry sectors. These include:

Please don’t hesitate to contact us if you cannot find what you are looking for or you would like some more information on the services we provide.

PARTNERSHIP SOURCING

FULL PROCUREMENT FACILITY

TECHNICAL PROJECT MANAGEMENT

RACK AND CHASSIS WIRING FITTING

MECHANCIAL ASSEMBLY TO FULL SYSTEM LEVEL

CABLE AND WIRE HARNESS ASSEMBLY

PROTOTYPE AND DEVELOPMENT EQUIPMENT MANUFACTURER

SURFACE MOUNT AND CONVENTIONAL PCB ASSEMBLY

PROTOTYPING – IN HOUSE FROM BOARD TO BOARD

COMPLETE ASSEMBLY

PRODUCT TESTING

X-RAY INSPECTION

BGA PLACMENT, RE-WORK AND RE_BALLING / RECOVERY

CIRCUIT DESIGN, PCB DESIGN AND LAYOUT

Working with surface mount, leaded, ball grid array and mixed technology PCBs, we specialise in low and medium volume projects from a single system or even a single PCB if required, to production quantities of up to a few thousand. We can also work with or on behalf of our client to source larger volume production when required. On the larger volume jobs, as throughput increases we can remain competitive while retaining consistency using our automated SMT.

Our investment and experience in BGA X-ray inspection, fault finding and identification of counterfeit devices, has enabled us to become one of the leaders in the re-working of BGAs. This work is undertaken on an hourly rate basis, the rate being determined by our work code, which is determined by the equipment and techniques used – our invoice will detail the exact time cost under each work code. All of our work is carried out and inspected to the procedures as laid down in our Quality Assurance manual, which is certified to ISO 9001:2008. We will provide a CERTIFICATE OF CONFORMITY with each X-Ray / rework job.

Our engineers produce high quality prototypes working straight from a parts list and drawings. As we can hand work most fine pitch devices and even BGAs, solder paste stencils and tooling are not always required. With no stencil and tooling charges or time delays we can often start work straight away, as soon as the quote has been raised and accepted.

The Ball Grid Array package has grown in popularity and diversified in type since we first started fitting the PBGA (Plastic) in 1996. Since then we have also gained experience with CBGA (Ceramic), TBGA (Tape) and uBGA (Micro), with pitches down to 0.5mm and number of contacts exceeding two thousand. Our X-Ray Inspection Service verifies quality on customer fitted devices. Some BGA devices are expensive or on a long delivery. We have invested a great deal into developing techniques to rework BGAs on completed PCB’s and can recover and re-ball your previously fitted devices.

All re-work and re-balling is carried out using a state of the art re-work station. The system is computer controlled which provides high accuracy, quality and guarantees consistency.

We work closely with a few select industry partners and are able to provide expertise in almost any complex product design. With an integrated approach from circuit design through to PCB production, we can help clients achieve both shorter production development cycles and lower costs. Our approach is also totally flexible, our clients employ our expertise to match their own available resources and can bring us on-board at the circuit design, PCB layout, prototyping, pre-production or assembly stage.



Our Customers Shanoc Electronics has many years of experience servicing major industry sectors. These include: AEROSPACE MINISTRY OF DEFENCE SATELLITE COMMUNICATION SYSTEMS MEDICAL MONITORING SYSTEMS TELECOMMUNICATIONS INSTRUMENTATION SECURITY CONTROL SYSTEMS EMBEDDED PC SYSTEMS SEMICONDUCTOR TEST SYSTEMS AUTOMOTIVE DIAGNOSTICS SYSTEMS Our Products and Services Please don’t hesitate to contact us if you cannot find what you are looking for or you would like some more information on the services we provide. PARTNERSHIP SOURCING FULL PROCUREMENT FACILITY TECHNICAL PROJECT MANAGEMENT RACK AND CHASSIS WIRING FITTING MECHANCIAL ASSEMBLY TO FULL SYSTEM LEVEL CABLE AND WIRE HARNESS ASSEMBLY PROTOTYPE AND DEVELOPMENT EQUIPMENT MANUFACTURER SURFACE MOUNT AND CONVENTIONAL PCB ASSEMBLY PROTOTYPING – IN HOUSE FROM BOARD TO BOARD COMPLETE ASSEMBLY PRODUCT TESTING X-RAY INSPECTION BGA PLACMENT, RE-WORK AND RE_BALLING / RECOVERY CIRCUIT DESIGN, PCB DESIGN AND LAYOUT PCB Assembly, conventional and surface mount Working with surface mount, leaded, ball grid array and mixed technology PCBs, we specialise in low and medium volume projects from a single system or even a single PCB if required, to production quantities of up to a few thousand. We can also work with or on behalf of our client to source larger volume production when required. On the larger volume jobs, as throughput increases we can remain competitive while retaining consistency using our automated SMT. X-ray Inspection Our investment and experience in BGA X-ray inspection, fault finding and identification of counterfeit devices, has enabled us to become one of the leaders in the re-working of BGAs. This work is undertaken on an hourly rate basis, the rate being determined by our work code, which is determined by the equipment and techniques used – our invoice will detail the exact time cost under each work code. All of our work is carried out and inspected to the procedures as laid down in our Quality Assurance manual, which is certified to ISO 9001:2008. We will provide a CERTIFICATE OF CONFORMITY with each X-Ray / rework job. Prototyping Our engineers produce high quality prototypes working straight from a parts list and drawings. As we can hand work most fine pitch devices and even BGAs, solder paste stencils and tooling are not always required. With no stencil and tooling charges or time delays we can often start work straight away, as soon as the quote has been raised and accepted. BGA placement, re-work and re-balling / recovery The Ball Grid Array package has grown in popularity and diversified in type since we first started fitting the PBGA (Plastic) in 1996. Since then we have also gained experience with CBGA (Ceramic), TBGA (Tape) and uBGA (Micro), with pitches down to 0.5mm and number of contacts exceeding two thousand. Our X-Ray Inspection Service verifies quality on customer fitted devices. Some BGA devices are expensive or on a long delivery. We have invested a great deal into developing techniques to rework BGAs on completed PCB’s and can recover and re-ball your previously fitted devices. All re-work and re-balling is carried out using a state of the art re-work station. The system is computer controlled which provides high accuracy, quality and guarantees consistency. Circuit design, PCB design and layout We work closely with a few select industry partners and are able to provide expertise in almost any complex product design. With an integrated approach from circuit design through to PCB production, we can help clients achieve both shorter production development cycles and lower costs. Our approach is also totally flexible, our clients employ our expertise to match their own available resources and can bring us on-board at the circuit design, PCB layout, prototyping, pre-production or assembly stage.